Shenzhen DeepMaterial Technologies Co. 所有产品目录和PDF技术手册

1. 

   DeepMaterial Waterproof epoxy uv curing adhesive

   3 页

2. 

   DeepMateriel Multipurpose UV Curing UV Adhesive

   3 页

3. 

   SMT Epoxy Adhesive

   3 页

4. 

   SMT Epoxy Red Adhesive

   3 页

5. 

   PCB Potting Compound

   3 页

6. 

   One Component Epoxy Adhesives

   3 页

7. 

   DeepMaterial one compoment epoxy adhesive for electronics manufacturing

   3 页

8. 

   DeepMaterial magnet bonding adhesive glue for magnets in electric motors

   3 页

9. 

   DeepMaterial Electrical Motor Magnet Bonding Adhesives For Industrial Assemblies

   3 页

10. 

    Multipurpose UV Curing UV Adhesive

    3 页

11. 

    COB Epoxy Encapsulation Mateials

    3 页

12. 

    Micro LED Large Screen Display Bonding

    3 页

13. 

    Expoxy Based Conductive Silver Adhesive

    4 页

14. 

    DeepMaterial Epoxy-Based

    3 页

15. 

    Micro LED Large Screen Display Bonding with DeepMatrial COB Encapsulation Materials

    3 页

16. 

    DeepMaterial Low Refractive Index Silicone

    3 页

17. 

    BGA Underfill Epoxy

    3 页

18. 

    Deep Material PCB smt underfill epoxy

    3 页

19. 

    DeepMaterial Underfill Epoxy Adhesive Glue

    3 页

20. 

    UV curable adhesive

    3 页

21. 

    UV Conformal Coating

    3 页

22. 

    Underfill Epoxy BGA

    3 页

23. 

    Two component Epoxy Adhesive

    4 页

24. 

    SMT Surface Mount epoxy adhesive

    3 页

25. 

    Silicone Conformal Coating For PCB

    3 页

26. 

    PUR Structural Adhesive

    3 页

27. 

    DeepMaterial One Compoment Epoxy Adhesive Glue For Electronics

    3 页

28. 

    Epoxy Encapsulant

    3 页

29. 

    Display Screen Assembly Application

    3 页

30. 

    Epoxy conformal coating For Electronics PCB Printed Circuit Board

    3 页

31. 

    Epoxy conformal coating and Epoxy Encapsulant for Electronics PCB

    3 页

32. 

    Best Strongest Waterproof Epoxy Adhesive

    3 页

33. 

    Waterproof adhesive glue

    4 页

34. 

    UV cure Assembly Adhesive and Encapsulants for Electronics

    4 页

35. 

    Two component epoxy adhesives

    5 页

36. 

    SMT SMD epoxy adhesive

    4 页

37. 

    Optical bonding adhesive

    4 页

38. 

    Epoxy-Based Chip Underfil and COB Encapsulation Materials

    5 页

39. 

    Hot melt adhesive glue

    4 页

40. 

    Chip Underfill / Packaging Application

    4 页

41. 

    Pressure sensitive adhesive manufacturers

    4 页

42. 

    Magnet bonding adhesives

    4 页

43. 

    Liquid optically clear adhesive

    4 页

44. 

    LCD optical bonding adhesive

    4 页

45. 

    Best epoxy adhesie for metal

    4 页

46. 

    One Component Mini Led And LCD Optical Bonding Adhesive Glue

    4 页

47. 

    Low Temperature Cure BGA Flip Chip Underfill PCB Epoxy Adhesive

    3 页

48. 

    Industrial Hot Melt Electronic Component Epoxy Adhesive

    3 页

49. 

    Benefits of DeepMaterial Electronic Grade Circuit board adhesive

    3 页

50. 

    Types of hot melt adhesives manufacturers

    3 页

51. 

    Epoxy Underfill Flip Chip Level Adhesives

    3 页

52. 

    UV Curing UV Adhesive

    13 页

53. 

    Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive

    10 页

54. 

    Epoxy-Based Chip Underfill And COB Encapsulation Materials

    7 页

55. 

    Circuit Board Protection Potting And Conformal Coating Adhesive

    5 页

56. 

    Epoxy Based Conductive Silver Adhesive

    3 页

57. 

    Structural Bonding Adhesive

    10 页

58. 

    Functional Protective Film

    3 页

59. 

    Semiconductor Protective Film

    3 页

60. 

    Industrial Hot Melt Electronic Component Epoxy Adhesive

    26 页